Hydrocarbon Polymer Ceramic Copper Clad Laminates with Woven Fiberglass

Product Details
Customization: Available
Type: Insulation Sheet
Material: Fiberglass
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Year of Establishment
2013-03-01
Management System Certification
ISO 9001, ISO 9000, ISO 13485
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  • Hydrocarbon Polymer Ceramic Copper Clad Laminates with Woven Fiberglass
  • Hydrocarbon Polymer Ceramic Copper Clad Laminates with Woven Fiberglass
  • Hydrocarbon Polymer Ceramic Copper Clad Laminates with Woven Fiberglass
  • Hydrocarbon Polymer Ceramic Copper Clad Laminates with Woven Fiberglass
  • Hydrocarbon Polymer Ceramic Copper Clad Laminates with Woven Fiberglass
  • Hydrocarbon Polymer Ceramic Copper Clad Laminates with Woven Fiberglass
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Basic Info.

Model NO.
CT338|350
Application
Cellular Base Station Antennas, Power-Amplifier
Flame Retardant Properties
HB
Mechanical Rigid
Fexible
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Brand
Wl
Classification
Organic Insulating Material
Color
White|Yellow
Dielectric Constant
3.48+-0.05
Thickness(mm)
Customized
Density(G/ Cm3)
1.9
Thermal Conductivity(W/M/K)
0.7
Transport Package
Standard Export Package
Trademark
WL
Origin
China
HS Code
7410211000
Production Capacity
50000PCS/Month

Product Description

Hydrocarbon polymer ceramic copper clad laminates with woven fiberglass (WL-CT350/338)

Hydrocarbon Polymer Ceramic Copper Clad Laminates with Woven Fiberglass


1. Description:
WL-CT350/338 is laminated by hydrocarbon polymer and ceramic with a woven fiberglass, it is a kind of thermoset laminates, it's belong high freqency CCL, and the quality & performance is comparable to similar foreign products. 

2. Advantages:
1). The hydrocarbon polymer ceramic woven fiberglass is a thermosetting resin system, which has a better hardness than PTFE thermoplastic resin system, has a good loss value.
2). Excellent PIM performance.
3). Dk, Df value is stable,  Dk/Df changes a little with the increase of frequency.
4). Good electrical performance,excellent thermal conductivity,and be better insulation and heat treatment capability than PTFE materials.
5). It can be compatible with the process of FR-4,no need for plasma process. The process is relatively simple, compatible with most PP films. Besides, PCB process is good, especially suitable for the manufacturing of multilayer PCB.
6). Low thermal expansion coefficient improves the reliability of the plating through hole and dimensional stability.
7). Especially suitable for lead-free soldering process.

 3.Specifications:
                    Types Double side
           Dimensions (mm)
 
460X610(18''X24''), 915X1224(36''X48'')
For special dimension, customized laminates is available.
         Dielectric constant 3.48±0.05
Dielectric thickness and Tolerance(mm) 0.762±0.05
Dielectric thickness can be customized.
         Optional copper foil  ED: 0.5OZ or 1OZ
 
           Dissipation factor
 
 
@2.5GHZ        unit: tgδ         0.0032
@10GHZ           unit: tgδ         0.0040
 Copper peel strength
(1oz copper) 
>9N/cm
Surface Resistivity
(M·Ω)
Condition: Normal state (500V DC)
≥ 4×108
Volume Resistivity
(MΩ.cm) 
Condition: Normal state
≥ 1×109
Tg(ºC) Test condition:TMA
>280ºC
Td(ºC) Test condition: TGA
386
             CTE(typical)
                X  Axis
                Y  Axis
                Z  Axis
Condition: -55ºC to 288ºC
11
14
34

 
  4.Applications:
         This kind of laminates is applicable for the communication of 4G and 5G,Cellular Base Station Antennas ,WIMAX Antenna Network,Automotive Radar and Sensors, Power Amplifiers, Rejector, RFcomponent, special communication device and so on.

 

Company Information

Hydrocarbon Polymer Ceramic Copper Clad Laminates with Woven FiberglassHydrocarbon Polymer Ceramic Copper Clad Laminates with Woven FiberglassHydrocarbon Polymer Ceramic Copper Clad Laminates with Woven FiberglassHydrocarbon Polymer Ceramic Copper Clad Laminates with Woven Fiberglass

 
 


 

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