| Customization: | Available |
|---|---|
| Type: | Polymer Ceramic Copper |
| Dielectric: | Polymer Ceramic Copper |
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High quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT338)
Model: WL-CT338
Introduction:
WL-CT338 is laminated by hydrocarbon polymerand ceramicreind forced with woven fiberglass through scientific formulation and strict process control. It is a kind of thermo-setlaminated, and the performance is consistent with foreign similar products. Application for the communication of 4G and 5G, Cellular Base Station Antennas, WIMAX Antenna Network, Autromotive Radarand Sensors, Power Amplifiers, Microwave Device, High Reliability Radar, Military communication device and soon.
Highlight:
1. The hydrocarbon polymer ceramic woven fiberglass is a thermosetting resin system, which has a better hardness than PTFE thermoplastic resin system, has a good loss value.
2. Excellent PIM performance
3. Dk, DF value is stable, DK/DF changes little with increase of frequency.
4. Good electrical performance, excellent thermal conductivity and be better insulation and heat treatment capability than PTFE materials.
5. It can be compatible with the process of FR-4, no need for plasma process. The process is relatively simple, compatible with most PP films.Besides, PCB process is good, especially suitable for the manufacturing of multilayer PCB.
6. Low thermal expansion co-efficient improves the reliablility of the plating through hole and dimensional stability.
7. Especially suitable for lead-free soldering process.
Specifications:
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Types |
Double side |
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Dimensions (mm) |
460X610(18''X24''), 500X600(19.69''X23.62''), 915X1220(36''X48'') |
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For special dimension, customized laminates is available. |
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Dielectric constant |
3.38±0.05 |
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Dielectric thickness (Choosing ED copper foil)and Tolerance(mm) |
1.016±0.05 |
| Dielectric thickness can be customized. | |
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Optional copper foil |
ED: 0.5OZ or 1OZ or RTF: 0.5OZ or 1OZ |
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Dissipation factor |
@2.5GHZ unit: tgδ 0.0024 |
| @10GHZ unit: tgδ 0.0029 | |
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Copper peel strength(1oz copper) |
ED: >9N/cm; RTF: >8N/cm |
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Surface Resistivity (M·Ω) |
Condition: Normal state (500V DC): ≥ 7×108 |
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Volume Resistivity(MΩ.cm) |
Condition: Normal state ≥ 6×109 |
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Tg(ºC) |
Test condition:TMA; >280ºC |
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Td(ºC) |
Test condition: TGA,421 |
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CTE(typical) |
Condition: -55ºC to 288ºC (X Axis: 14; Y Axis: 16; Z Axis: 50) |
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