Customization: | Available |
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Type: | Polymer Ceramic Copper |
Dielectric: | Polymer Ceramic Copper |
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High quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300)
Model: WL-CT300
Introduction:
WL-CT300 is laminated by hydrocarbon polymer and cermaic with a woven fiberglass reinforcement through scientific formulation and strict technology procedures. It is a kind of thermoset laminates, and the performance is consistent with foreigh similar products.
Highlight:
1. The hydrocarbon polymer ceramic woven fiberglass is a thermosetting resin system, which has a better hardness than PTFE thermoplastic resin system, has a good loss value.
2. Excellent PIM performance
3. Dk, DF value is stable, DK/DF changes little with increase of frequency.
4. Good electrical performance, excellent thermal conductivity and be better insulation and heat treatment capability than PTFE materials.
5. It can be compatible with the process of FR-4, no need for plasma process. The process is relatively simple, compatible with most PP films.Besides, PCB process is good, especially suitable for the manufacturing of multilayer PCB.
6. Low thermal expansion co-efficient improves the reliablility of the plating through hole and dimensional stability.
7. Especially suitable for lead-free soldering process.
Specifications:
Types |
Double side |
Dimensions (mm) |
460X610(18''X24''), 915X1220(36''X48'') |
For special dimension, customized laminates is available. |
|
Dielectric constant |
3.00±0.05 |
Thickness and Tolerance(mm) |
1.034±0.076 |
Dielectric thickness can be customized. | |
Thickness of RTF copper foil |
RTF: 0.5OZ or 1OZ |
Dissipation Factor (DF) | @10GHZ unit: tgδ 0.0031 |
Copper peel strength(1oz copper) |
7.2N/cm |
Surface Resistivity (M·Ω) |
Condition: Normal state (500V DC): ≥ 2×108 |
Volume Resistivity(MΩ.cm) |
Condition: Normal state ≥ 3×108 |
Tg(ºC) |
Test condition:TMA; >280ºC |
Td(ºC) |
Test condition: TGA,421 |
CTE(typical) |
Condition: -55ºC to 288ºC (X Axis: 15; Y Axis: 14; Z Axis: 31) |